Innovation Birmingham jets off to India in new partnership with Tech Link Group

January 3, 2017

Innovation Birmingham will take a select group of the SMEs based at the Campus to India in 2017, to explore investment and partnership opportunities in an economy and market which has become even more significant to Britain following the decision to leave the European Union.


The trip will explore the potential of meeting with 400 exhibiting companies, 10,000 visitors from India and overseas and circa 500 overseas delegates at the IESS International Engineering Sourcing Show in Chennai this coming March.


As the leading location for Birmingham’s tech and digital start-up community, Innovation Birmingham provides office suites, meeting and conference facilities, co-working opportunities, start-up mentoring and funding support for innovators, entrepreneurs and investors looking to develop or fund innovative digital start-ups with high growth potential.


Cliff Dennett, Head of Business Development at Innovation Birmingham, said: “IESS 2017 will be showcasing sectors that are relevant to many of our tenants, particularly innovation and technology. The show was brought to our attention by Ricardo D’Souza and Ekwall Tiwana of Edgbaston-based Tech Link Group Ltd, which has partnered with IESS 2017 to offer British organisations easy access to the show and its benefits, including JV, investment and partnering opportunities.


“Birmingham is home to many start-up and mature digital and tech organisations and the wider area is steeped in an industrial heritage. IESS offers access to a vast talent pool of experienced coders and other tech personnel which, for example, could benefit many tech start-ups here. I’m also looking forward to exploring the partnership and investment opportunities into the UK from India.”


IESS 2017 is the sixth show of its type organised by the Ministry of Commerce & Industry, Government of India, with Engineering Export Promotion Council (EEPC India) as the lead agency. 


The shows organising body, EEPC India, appointed Tech Link Group Ltd earlier this year to oversee applications for the Overseas Delegates Incentive Package. In previous years, UK delegations were accompanied and supported by members of the Tech Link Group Ltd team who liaised directly with organisers to ensure a seamless and effective experience.


The Incentive Package for British delegates via Tech Link Group Ltd is:

  • B2B meetings with profile-matched Indian exhibitors for business partnership and investment

  • Opportunity to network with over 10,000 business visitors and 500 delegates

  • Wide circulation of the delegate profile throughout EEPC Network (around 13,000 engineering members) and non-members’ database (100,000)

  • Air fare reimbursement up to US $500 complimentary 3-night hotel stay

  • Indian Culture programme and gala dinner

  • Complimentary airport pick-up and drop shuttle service

  • Exhibition centre drop and pick up service

  • Complimentary lunch at the exhibition centre

Ricardo D’Souza, CEO of Tech Link Group, said: “There has long-existed reciprocal respect and synergy between businesses in Britain and India and now, following the Brexit, is arguably the best time for organisations in both countries to talk and consider ways of working together for their mutual commercial benefit.”

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